WEE Technology Company Limited
Manufacturer of Surface Mounted (SMD) and Throught Hole (DIP) Diodes and Rectifiers.

GPP chip series rectifier bridge product features:

1. The common cathode mode of 4 chips is adopted to make the structure more concise and clear;

2. The lower solder paste is printed to ensure the consistency of solder paste quantity,

At the same time, it also solves the phenomenon of chip edge and corner weld caused by dispensing;

3. The fast bare metal welding method not only improves the welding efficiency, but also reduces the power loss.

4. The first three, the second and the fifth tests are used to ensure the comprehensive test of parameters. At the same time, the data acquisition system saves all the tested parameters for easy query and analysis;

GPP chip thin bridge rectifier device, its transmission current is mainly divided into 1A, 2A, 3A, 4A, 6A, 8A, 10A, 15A, 20A, 25A, 35A,50A;
The reverse breakdown voltage varies from 50V, 100V, 200V, 400V, 600V, 800V and 1000V according to chip specifications.

GBJ10-50A：GBJ1010、GBJ1510、GBJ2510、GBJ3510，GBJ5010

It is widely used in 3C mobile phone charger, router, adapter, large and medium-sized computers, microcomputer peripherals, program-controlled exchange, broadcast communication, instruments and meters, and rectification circuit in industrial control;