WEE Technology Company Limited
Manufacturer of Surface Mount (SMD) and Through Hole (DIP) Diodes & Rectifiers.
WEET Surface Mount (SMD) Diodes Production Process Flow
Solder Paste | ---> | Dice Assembled | ---> | Soldering | ---> | IPA Cleaning | ---> | Epoxy Molding |
| IPQC | IPQC | IPQC | ↓ | |||||
| TMTT Testing | <--- | Lead Tin Plating | <---- | Trim Form | <--- | De-flash | <--- | After Curing |
| ↓ | OQC | OQC | ||||||
Labeling Packing | ---> | Apperance Checking | ---> |
Stock | ---> | Outgoing Inspection |
WEET Through Hole (DIP) Diodes Production Process Flow
Wire Arranged | ---> | Solder Assembled | ---> | Dice Assembled | ---> | Solder Assembled |
| IPQC | IPQC | ↓ | ||||
| The Gluing | <--- | Pickling | <--- | Conversion | <--- | Soldering |
| ↓ | IPQC | IPQC | ||||
| SKY-GPP | ---> | Epoxy Molding | ---> | Epoxy Curing | ---> | Lead Tin Plating |
| IPQC | IPQC | ↓ | ||||
Outgoing Inspection | <--- | Stock | <--- | Labeling Packing | <--- | Apperance Checking |
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